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Camera Size : Supports rapid sample customization
Sensor Brand : STMicroelectronics
Model Number : VD55G4
Optical format : 1/9 inches
Max Frame rates : 194 fps
FOV : DFOV:20°-180°(Optional or customized)
Pixel Size : 2.16 micron*2.16 micron
Data Interface : MIPI 1 Lane/SPI/I3C
Power : 2.8V/1.8V/1.1V
Focus mode : FF
Active Array Size : 804*704
Shutter : Global Shutter
IR Filter : Clear/650nm/850nm/940nm(Optional or customized)
Sensor Type : VD55G4CCC0
Brand Name : Chippack
Color : MONO
0.56 MP MONO Global 160.3 - Degree View Shutter Camera Module VD55G4 Sensor For Machine Vision
1. Basic Parameters:
‑ Resolution: 804 (H) × 704 (V), 0.56MP. Optimized for lightweight high‑precision visual acquisition scenarios, balancing imaging clarity and low‑load device requirements.
‑ Pixel Size: 2.16μm (H) × 2.16μm (V). Features an optimized pixel structure design that reduces sensor size while delivering excellent light‑sensing performance and imaging accuracy.
‑ Optical Format: 1/9‑inch. Boasts outstanding quantum efficiency, optimized for near‑field sensing, low‑light imaging and dynamic scenes with strong anti‑interference imaging capability.
‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It operates stably under various voltage conditions to ensure sensor reliability.
‑ Temperature Range: Operating temperature from ‑30℃ to 85℃. The wide operating‑temperature range enables adaptability to diverse working environments.
2. Technical Features:
‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption requirements for lighting.
‑ Adopts advanced 3D‑stacked and BSI (Back‑Side Illumination) processes. Circuits and light‑sensitive layers are arranged in separate layers, greatly shrinking sensor dimensions with minimal overall footprint. It features high integration and simple peripheral matching circuits, supports multiple data‑output formats including RAW8 and RAW10, and is compatible with the common MIPI CSI interface. With strong hardware compatibility, it can be rapidly integrated into various compact smart devices to shorten product R&D and implementation cycles.
‑ Multiple embedded image‑enhancement functions are integrated, including auto‑exposure, intelligent noise reduction, pixel defect correction, multi‑exposure fusion and more. It can output high‑definition, low‑noise, high‑contrast images without an external dedicated image‑processing chip. The product achieves a dynamic range of 68dB, maintaining clear and stable imaging under complex lighting conditions such as alternating bright‑dark scenes and low‑light environments, and effectively improving visual‑recognition accuracy.
‑ VD55G4 Camera Module: Supports standard modules with different lens configurations including 160.3° to meet diverse customer requirements.
3. Application Fields:
Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.
4. Customization Services:
Custom‑built modules can be produced according to customer requirements to deliver tailor‑made products.
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0.56 MP MONO Global 160.3 - Degree View Shutter Camera Module VD55G4 Sensor For Machine Vision Images |